Equipments Details
Description
Manufacturer and model:
Deep RIE Versaline DSE.
Description:
Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.
Specification:
Recommended for MEMS production.
Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
Deep RIE Versaline DSE.
Description:
Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.
Specification:
Recommended for MEMS production.
Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.
Location:
Engineering Cleanroom, Wolfson building of Electrical Engineering.
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