Deep RIE Versaline DSE

  • Erez Benjamin (Manager)University Center for Nanoscience and Nanotechnology, Tel Aviv University

Equipment/facility: Equipment

    Equipments Details


    Manufacturer and model:
    Deep RIE Versaline DSE.

    Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.

    Recommended for MEMS production.
    Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
    Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.

    Engineering Cleanroom, Wolfson building of Electrical Engineering.


    Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.