Deep RIE Versaline DSE

  • Erez Benjamin (Manager)University Center for Nanoscience and Nanotechnology, Tel Aviv University

Equipment/facility: Equipment

    Equipments Details

    Description

    Manufacturer and model:
    Deep RIE Versaline DSE.

    Description:
    Deep Silicon Etcher for High aspect ratio (HAR) micro-nano features as well as for fast isotropic silicon wafer thinning.

    Specification:
    Recommended for MEMS production.
    Including Bosch process - the cyclic isotropic etching and fluorocarbon-based protection film deposition.
    Typical Etching rate for 4 inch silicon wafer: ~0.21 um/cycle.

    ‚ÄčLocation:
    Engineering Cleanroom, Wolfson building of Electrical Engineering.

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