Ball Wire Bonder

  • Nirit Porecki-Shamay (Manager)
Center for Nanoscience and Nanotechnology

Equipment/facility: Equipment

    Equipments Details

    Description

    Manufacturer and model:
    Kulicke & Soffa 4524 Digital Wire Bonder

    Specification:
    ± 0.5 µm placement accuracy.
    ± 1 µm post-bond accuracy.

    ​Location:
    Wolfson building of Electrical Engineering, Room #301

    Contact Information

    Emailsnporecki@tauex.tau.ac.il

    Equipment hierarchy

    Back-end
    Ball Wire Bonder